Labels Milestones
BackBGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 34x34.
- HLE-121-02-xx-DV-TE, 21 Pins per row.
- 10x8.1mm^2 drill 1.1mm pad.
- 9.665134e+01 8.881824e+00 facet normal 0.977419 0.186452 0.0994337.