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3D Printing/Pot_Knobs/knob.scad Executable file View File Panels/FireballSpellVertSmaller.png Normal file Unescape Schematics/SynthMages.pretty/Perfboard_4x12.kicad_mod Normal file Unescape Hardware/Panel/precadsr_panel.png Normal file View File Schematics/Rampage_V1_4_Sch.pdf Normal file Unescape Hardware/PCB/precadsr_aux_Gerbers/precadsr-F_Paste.gbr Normal file View File Schematics/Fireball.kicad_sch Normal file Unescape Schematics/SynthMages.pretty/Micro SPDT (3 pin).kicad_mod Schematic updates main synth_tools/Schematics/SynthMages.pretty/Perfboard_3x12.kicad_mod 80 lines Add radio shaek with cv2 version d7370bb10c Add tl074 datasheet/pinout Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell names on narrower widths. The first two groups should be possible, too * Manual trigger * See manual step (sw13 // 1 rotary switch, 5+ positions 10 LEDs 3 sockets 6 sockets main MK_VCO/Schematics/MK_VCO_RADIO_SHAEK_try1.diy 7479 lines d48d677c91 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/COLOR SPRAY.png and /dev/null differ # 2-layer, 1oz copper condition "A.Type == 'pad' && !A.isPlated()" condition "A.isPlated() && B.Type == 'track'" (condition "A.Type == 'via' && B.Type == A.Type && A.Net == B.Net" condition "A.Type == 'track' && B.Type == A.Type" (condition "A.Type == 'pad' && !A.isPlated()" condition "A.isPlated() && B.Type == A.Type && A.Net != B.Net" (condition "A.Pad_Type == 'NPTH, mechanical' && B.Type == A.Type" condition "A.Type == 'via'" condition "A.Type == 'via' && B.Type == 'track'" From f12031bb4117bdc0bfa93734f5e1f978a14297b0 Mon Sep 17 00:00:00 2001 main drumkit/.gitignore 32 lines 74231bd333 Go to file 6523065365 updates the potentiometer pads and trace routing to de-bodge the pots. Updates the potentiometer pads and thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 7x7mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout.

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