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Pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for mini circuit case CD542, Land pattern PL-094, pads 5 and 6); middle of slider panel (between steps 5 and 2 connected via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern PL-176, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for Mini-Circuits.

• -4.056728e+000 5.738834e+000 1.747200e+001 facet normal 9.196532e-01 3.452139e-03 -3.927162e-01.
• 3.756590e+000 4.215425e+000 9.983999e+000 vertex 5.517357e+000 -1.375710e+000 9.983999e+000 vertex.
• Normal 0.956918 -0.290358 0 facet normal 6.470718e-01.
• 0.900348 0.423675 0.0993603 facet normal 4.225832e-001 9.496832e-004 9.063236e-001.
• Fuse 0ZRE0008FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf Fuse 0ZRE0100FF.

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