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Pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770974-x, 8 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 2mm, outer diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00232_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO 236-403, 45Degree (cable under 45degree), 3 pins, pitch 5.08mm, size 25.4x10.6mm^2, drill diamater 1.3mm, pad diameter 3mm, see .