3
1
Back

0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://www.ti.com/lit/pdf/qfnd619), generated with kicad-footprint-generator Capacitor SMD AVX-V (7361-38 Metric), IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 5268-10A, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0050, 5 Circuits (https://www.molex.com/pdm_docs/sd/2005280050_sd.pdf), generated with kicad-footprint-generator Through hole pin header THT 1x15 2.00mm single row Through hole straight socket strip, 2x03, 1.27mm pitch, single row Through hole straight pin header, 2x29, 1.27mm pitch, single row style2 pin1 right Through hole pin header THT 2x21 2.00mm double row Through hole pin header THT 1x28 2.54mm single row Through hole angled pin header, 1x08, 2.54mm pitch, 8.51mm socket length, single row style2 pin1 right Through hole angled socket strip, 2x26, 1.27mm pitch, 4.0mm pin length, single row Surface mounted pin header SMD 1x36 1.27mm single row Surface mounted socket strip SMD 1x22 2.54mm single row Through hole angled pin header THT 1x26 2.00mm single row Through hole socket strip SMD Solder Jumper, 1x1.5mm, rounded.

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