Labels Milestones
BackTSOP-xxxx, MOLD package, see https://www.vishay.com/docs/82493/tsop311.pdf package for diode bridges, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 8x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST Copal_CVS-02xB, Slide, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm.
- Connector, S22B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN.
- Knob, one jack, plus space between them //left_panel_spacing.