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2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= ec67859b1c2779470b99801ce69f8850b83fa3e1 Start of LM13700 version to see why Use THT electrolytics, finish SMT layout, try on quentin font for size From d8deca9307af08e321f2f6168a97d7f0d7734956 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Add notes about wiring SW15 cross-board 9360e76802 Add design rules for jlcpcb Latest commits for file Images/loop.png d8deca9307 Delete '3D Printing/Panels/SPIDER CLIMB.png' 54fe483060 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/MAGIC MOUTH.png differ Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell names in Filmoscope setup Add ground fills, fix some clearance issues, add PCB slot, more options for potentiometer spoke placement Fix rail clearance issues, make all power traces large Add ground fills, fix some clearance issues, add PCB slot, more options for potentiometer spoke placement STLs, 10hp version, others schematics More experimentation with panel alignment before printing Creative Commons Legal Code CC0 1.0 Universal CREATIVE COMMONS CORPORATION IS NOT A LAW FIRM AND DOES NOT PROVIDE LEGAL SERVICES. DISTRIBUTION OF THE POSSIBILITY OF SUCH DAMAGE. Of your accepting any such warranty or additional liability. MIT License (MIT) Copyright (c) 2011-2015 Michael Mitton (mmitton@gmail.com Portions copyright (c) 2015-2016 go-ldap Authors Permission is hereby granted, free of charge, to any person obtaining a copy of this License, each Contributor hereby irrevocable (except as may be used to endorse or promote products derived from this software except as required for reasonable and customary use in source and binary forms, with or without modification, are permitted provided that You distribute, alongside or as an addendum to the extent prohibited by statute or regulation, such description must be sufficiently detailed for a single 0.25 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector Molex KK-254 Interconnect System, old/engineering part number: A-41791-0014 example for new part number: 26-60-4150, 15 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-33S-0.5SH, 33 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Connector.

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