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Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (JEDEC MO-241/VAA, https://assets.nexperia.com/documents/package-information/SOT762-1.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5569-10A2, example for new part number: A-41792-0009 example for new mpn: 39-30-0040, 2 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, 2 LEDs, tab down, http://www.hanrun.com/public/upload/down/2020/09-11/cc11be56d66bb63d5f1eeb85492439c0.pdf Through hole angled socket strip SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open, labeled with numbers SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open, labeled with numbers SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, bridged with 1 copper strip SMD 2x15 1.27mm double row Through hole vertical IDC box.

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