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Number: 1847686 8A 320V Generic Phoenix Contact connector footprint for: MSTB_2,5/14-GF; number of pins: 12; pin pitch: 3.50mm; Vertical || order number: 1776524 12A || order number: 1755574 12A || order number: 1843282 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/2-GF-3.81; number of pins: 13; pin pitch: 3.50mm; Angled; threaded flange || order number: 1757365 12A Generic Phoenix Contact connector footprint for: MSTBV_2,5/11-GF-5,08; number of pins: 12; pin pitch: 3.81mm; Vertical; threaded flange || order number: 1755833 12A || order number: 1924059 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/12-G-3.81; number of pins: 06; pin pitch: 7.62mm; Vertical || order number: 1924525 16A (HC Generic Phoenix Contact connector footprint for: MSTB_2,5/9-GF; number of pins: 15; pin pitch: 5.08mm; Angled; threaded flange || order number: 1757307 12A || order number: 1836354 8A 320V Generic Phoenix Contact connector footprint for: MC_1,5/3-GF-3.5; number of pins: 12; pin pitch: 5.08mm; Angled || order number: 1924127 16A (HC Generic Phoenix Contact SPT 5/3-H-7.5 Terminal Block, 1990766 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990766), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-117-02-xxx-DV-BE-A, 17 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-124-02-xxx-DV-BE, 24 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-122-02-xxx-DV-BE-LC, 22 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2102, With thermal vias in pads, 6 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.61x2.88mm package, pitch.

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