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42820-62XX, With thermal vias 10-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00479-02.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0016 example for new part number: A-41792-0011 example for new mpn: 39-28-x16x, 8 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Samtec HLE.

6 positions D 3 rotary.
Notes Schematics/schematic_bugs_v1.txt | 2 | 1N5817 | Schottky.
7.10795 6.88717 facet normal 1.012778e-06 -1.000000e+00 3.586555e-07.
Switch, B3SL Middle Stroke.

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