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Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (2mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CN (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic Dual Flat No Lead Package (UC) - 3x3x0.5 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf VSON, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf), generated with kicad-footprint-generator JST SH series connector, S13B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator TE, 826576-2, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7811545, 15 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000992393), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM02B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UFQFPN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68), generated with kicad-footprint-generator ipc_noLead_generator.py QFN.

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