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3.95x5.21x3.27mm Pitch 1.27mm 50ohms AXICOM HF3-Series Relay Pitch 1.27mm SSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=34), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-4070, 7 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-20DP-2DSA, 10 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 5, Wuerth electronics 9774040482 (https://katalog.we-online.de/em/datasheet/9774040482.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas QFN, 24 Pin (JEDEC MS-013AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/rw_16.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 2 mm² wire, basic insulation, conductor diameter 1.7mm, outer diameter 2.3mm, size.

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