Labels Milestones
Back5.3 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 24 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic.
- 0.567807 7.3441 6.91407 facet normal 1.011997e-14.
- 3.4448888,6.1180983 3.2283537,6.0600779 3.069839,5.9015632 3.0118186,5.6850281 3.069839,5.468493 3.2283537,5.3099783 0.2165352,-0.05802 0.2165351,0.05802.
- UKG52(46) package, QFN-52-1EP variant (see http://cds.linear.com/docs/en/datasheet/3886fe.pdf MLF.