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LGA, 16 Pin (https://www.diodes.com/assets/Datasheets/PI6C5946002.pdf#page=12), generated with kicad-footprint-generator connector JST EH vertical JST ACH vertical JST XA series connector, SM10B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Hirose DF13 horizontal Hirose FH12, FFC/FPC connector, AFC07-S24FCA-00, 24 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 52 Pin (JEDEC MS-013AC, https://www.analog.com/media/en/package-pcb-resources/package/233848rw_20.pdf), generated with kicad-footprint-generator connector Molex CLIK-Mate series connector, S06B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 10 Pin (http://www.ti.com/lit/ds/symlink/ads1115.pdf), generated with kicad-footprint-generator JST XH side entry Molex Nano-Fit Power Connectors, 43915-xx08, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M1.6, height 4.5, Wuerth electronics 9774020960 (https://katalog.we-online.de/em/datasheet/9774020960.pdf,), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0170, 17 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 9x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 DIL DIP PDIP 2.54mm 15.24mm 600mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT.

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