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26-60-5150, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B6P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-174 , 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, 53398-1571 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0250, 25 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B18B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; thermal pad TSSOP HTSSOP 0.65 thermal pad HTSSOP32: plastic thin shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 40 Pin (JEDEC MO-153 Var FF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Tantalum Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.127 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 1.7mm, outer diameter 3mm, see , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00236 pitch 5.08mm length 7mm diameter 3.3mm Fastron MICC Inductor, Axial series, Axial, Vertical, pin pitch=7.62mm, , length*diameter=24*7.5mm^2, Fastron, MESC, http://cdn-reichelt.de/documents/datenblatt/B400/DS_MESC.pdf Inductor Axial series Axial Vertical pin pitch 37.50mm length 41.5mm width 9mm height 9mm Resistor, Axial_Power series, Axial, Vertical, pin pitch=5.08mm, , length*diameter=9.5*4mm^2, Fastron, SMCC, http://cdn-reichelt.de/documents/datenblatt/B400/DS_SMCC_NEU.pdf, http://cdn-reichelt.de/documents/datenblatt/B400/LEADEDINDUCTORS.pdf Inductor Axial series Axial Vertical pin pitch 5.08mm size 71.1x11.2mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00053 pitch 5mm size 25x12.6mm^2 drill 1.3mm pad 2.6mm terminal block RND 205-00022, 12 pins, pitch 10mm, size 22.3x14mm^2, drill diamater 1.2mm, pad diameter 2.2mm, see http://www.mouser.com/ds/2/324/ItemDetail_1725672-916605.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 804-302, 45Degree (cable under 45degree), 4 pins, pitch 2.54mm, size 28.4x6.5mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00078_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 804-115 45Degree pitch 5mm size 50x9mm^2 drill 1.3mm pad 2.6mm terminal block RND 205-00066, 45Degree (cable under 45degree), 4 pins, single row Through hole angled pin header, 1x32, 2.54mm pitch, 8.51mm socket length, single row Through hole socket strip THT 2x31 2.54mm double row Through hole pin.

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