synth_tools

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Cv_in_2a = [left_col, row_1, 0]; saw_out = [h_margin + working_width/4, row_1, 0]; fm_pot = [input_column - h_margin/2, bottom_row, 0]; pwm_pot = [input_column - h_margin/2, row_1, 0]; square_out = [width_mm-h_margin, row_1, 0]; audio_out_2 = [right_col, row_5, 0]; audio_out_1 = [right_col, row_7, 0]; manual_1 = [left_col, row_5, 0]; audio_out_1 = [right_col, row_7, 0]; cv_in_1b = [right_col, row_2, 0]; fm_lvl = [h_margin+working_width/8, row_2, 0]; fm_lvl = [second_col, second_row, 0]; //Third row interface placement f_tune = [h_margin+working_width/8, row_2, 0]; fm_in = [h_margin+working_width/8, row_2, 0]; f_tune = [width_mm/2 - h_margin, top_row, 0]; f_tune = [h_margin+working_width/8, row_2, 0]; fm_lvl = [h_margin+working_width/8, row_3, 0]; left_rib_x = hole_dist_side + thickness; right_rib_x = width_mm - thickness*2; // draw a "vertical" wall to mount a circuit board for a single 0.1 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 2mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0244, 24 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0930, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Inductor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-143-02-xxx-DV-A, 43 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B7P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-136-02-xxx-DV, 36 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/12-H-5.0-EX Terminal Block, 1719202 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719202), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 3, Wuerth electronics 9774080243 (https://katalog.we-online.de/em/datasheet/9774080243.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A BGA 1156 1 RF1157.

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