Labels Milestones
BackIpc_noLead_generator.py WSON-10 package 2x3mm body, pitch 0.5mm, thermal vias in pads, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 32-Lead Frame Chip.
- Design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA.
- 42819-32XX, 3 Pins per row, Mounting.