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On http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 4.201x4.663mm package, pitch 0.8mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf QFN, 48 Pin (https://static.dev.sifive.com/SiFive-FE310-G000-datasheet-v1p5.pdf#page=20), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0007 example for new part number: A-41791-0009 example for new mpn: 39-30-0200, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Diode, Universal, MELF, RM10, Handsoldering, SMD, Thruhole Diode Universal SMB(DO-214AA) SMC (DO-214AB) RM10 Handsoldering SMD Thruhole Diode, MicroMELF, Reflow Soldering, http://www.vishay.com/docs/85597/bzm55.pdf Diode Mini-MELF (SOD-80) Handsoldering Microsemi Powermite 3 SMD power inductor, 3.0x2.8x2.5mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-0703 unshielded SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5340 Microsemi Powermite 2 SMD power inductor, 4.5x4.0x3.2mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-0504 unshielded SMD power inductor, 0808, 1.9x2.0mm, https://www.coilcraft.com/getmedia/50382b97-998f-4b75-b5ee-4a93b0ac4411/xfl2010.pdf Wire Wound Chip Common Mode Line Filter, https://www.we-online.de/katalog/en/WE-SL5/, https://www.we-online.de/katalog/datasheet/744272471.pdf SMT Common Mode Line Filter, https://www.we-online.de/katalog/en/WE-SL5/, https://www.we-online.de/katalog/datasheet/744272471.pdf SMT Common Mode Line Filter API Delevan, Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89011xx, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator LED SMD https://www.kingbrightusa.com/KCpack.asp?txtPack=APHBM2012 Kingbright, dual LED, red-green, dome lens, 3.2 x 2.4 mm Surface Mount Tactile Switch with High Contact Reliability, Side-actuated Model, without Ground Terminal, without Boss Ultra-small-sized Tactile Switch SPST Slide 8.9mm 350mil SMD 2x-dip-switch SPST Copal_CVS-02xB, Slide, row spacing 10.16 mm (400 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 10x-dip-switch SPST KingTek_DSHP10TJ, Slide, row spacing 25.4 mm (1000 mils 64-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD.

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