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43160-0106, With thermal vias in pads, 5 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-16A2, example for new mpn: 39-30-0100, 5 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator connector wire 0.127sqmm double-strain-relief Soldered wire connection, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 0.9mm, length 10.0mm, width 2.4mm solder Pin_ with flat fork, hole diameter 0.7mm THT pad as test Point, diameter 4.0mm, hole diameter 0.5mm test point SMD pad as test point, loop diameter2.6mm, hole diameter 1.2mm THT pad THT pad THT pad THT pad as test point, loop diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00287_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00031, 10 pins, single row (from Kicad 4.0.7!), script generated Through hole straight socket strip, 1x29, 2.00mm pitch, 6.35mm socket length, double rows Surface mounted pin header THT 2x23 2.00mm double row surface-mounted straight socket strip, 2x38, 2.00mm pitch, 6.35mm socket length, single row style1 pin1 left Surface mounted socket strip SMD 1x06 1.00mm single row Surface mounted pin header THT 1x35 1.27mm single row Through hole angled socket strip, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 1x16, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through.

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