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66x11.2mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00078_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00296 pitch 5.08mm length 30mm diameter 15mm Electrolytic Capacitor CP, Radial series, Radial, pin pitch=5.00mm, , diameter*width=6*2.5mm^2, Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf C Disc series Radial pin pitch 5.08mm size 35.6x11.2mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type101_RT01602HBWC, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-1034IDT(Ver.9A).pdf LED Round FlatTop diameter 5.0mm z-position of LED center 3.0mm, 2 pins, diameter 5.0mm z-position of LED center 3.0mm, 2 pins, pitch 2.54mm, package size 32.2x9.1x15mm^3, https://www.recom-power.com/pdf/Innoline/R-5xxxPA_DA.pdf RPA60-FW 60W Isolated DC to 11GHz Molex MMCX Horizontal Coaxial Molex MMCX Coaxial Connector 50 ohms Female Würth WR-MMCX PCB SMT Jack, Horizontal (https://www.we-online.com/components/products/datasheet/66011102111302.pdf Jushuo AFC07, FFC/FPC connector, AFC07-S24FCA-00, 24 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 6-Lead Plastic Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 32 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 28 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (JEDEC MO-153 Var EA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0301, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S3B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST XH series connector, B14B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 10, Wuerth electronics 9774080960 (https://katalog.we-online.de/em/datasheet/9774080960.pdf,), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xx-DV-TE, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator connector TE MATE-N-LOK top entry Molex MicroClasp Wire-to-Board System, 55932-1010, with PCB locator, 10 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-113-02-xxx-DV-A, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P; No exposed pad 8-Lead Plastic Small Outline (SM) - 5.28 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 14-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to trigger, gate jack is normalized\nto +12 V, 10 mA -12 V ## Photos [to be added] ## Documentation: * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf) * [BOM](Docs/precadsr_bom.md) * [Build notes](Docs/build.md ## GitHub repository ## Git repository From.

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