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[DFN] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator JST XA series connector, B18B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-10P-1.25DSA, 10 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 128 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/q128.14x14.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-114-02-xxx-DV-BE, 14 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 42820-32XX, With thermal vias in pads, 6 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator Resistor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-116-02-xxx-DV-BE-LC, 16 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 32 Pin (https://www.ti.com/lit/ds/symlink/bq25703a.pdf#page=90), generated with kicad-footprint-generator Molex PicoBlade series connector, 502585-0270 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator connector JST ZE series connector, SM02B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.15 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py VLGA, 4 Pin (http://www.vishay.com/docs/83510/tcmt1100.pdf), generated with kicad-footprint-generator Hirose series connector, 502585-1570 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (https://www.ti.com/lit/ds/symlink/bq25703a.pdf#page=90), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 09-65-2028, 2 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (JEDEC MO-241/VAA, https://assets.nexperia.com/documents/package-information/SOT762-1.pdf), generated with kicad-footprint-generator Fuse SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator Molex.

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