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16.0x17.2mm Pitch 1mm ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 6x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, horizontal, https://www.cliffuk.co.uk/products/testleads/sockets/S16NPC.pdf cliff 4mm socket jack banana C5080 SERIES 90° Wafer, (https://datasheet.lcsc.com/lcsc/1912261836_HR-Joint-Tech-Elec-C5080WR-04P_C477015.pdf connector side-entry ATA PATA IDE 5.25 inch floppy drive power USB 3.0, type A, right angle through hole 2.25mm, height 6, Wuerth electronics 9774100482 (https://katalog.we-online.de/em/datasheet/9774100482.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 42819-32XX, With thermal vias in pads, 6 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, B7B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5569-04A1, example for new mpn: 39-28-920x, 10 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator JST XA series connector, S8B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 64 Pin (JEDEC MO-153 Var FA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator JST XA series connector, B02B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005474E.pdf#page=25), generated with kicad-footprint-generator.

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