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// actually.. I don't know what this does. Pad = 0.2; // this should be the same, the other Ground planes: ground planes connect to holes - these gaps reduce heat conduction during soldering - ground plane 56529bef3a0c7d0b31cfccd6b6ce971fb35b4e9c Updates from real TL0x4s d12ec1f19bbae8f01395e4c76a152d3d4ce7a3d4 created pull request synth_mages/MK_VCO#3 From 3d0ca7fdf6e2ad8d7864221e585c668e46544055 Mon Sep 17 00:00:00 2001 Subject: [PATCH] tracks the ratsnest and compactifies the power safety block and into any non-high-impedence connections; that is, fat traces to chip power, but not necessary for old fogeys like me to get below 200bpm - C1 is too small for film; is film needed? - Smaller cap (476nF?) for C1 Ceramic 104s for C10, C14.

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