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BackBump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Surface mounted socket strip SMD 1x37 1.27mm single row Through hole angled pin header, 1x01, 1.27mm pitch, double rows Through hole pin header THT 2x33 2.54mm double row surface-mounted straight pin header, 2x28, 1.00mm pitch, 2.0mm pin length, single row (from Kicad 4.0.7!), script generated Surface mounted socket strip SMD 1x06 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x27 2.54mm double row surface-mounted straight socket strip, 2x17, 2.00mm pitch, double rows Through hole straight Samtec HPM power header series.
- Not available, but a bitmap generator is available.
- SWRB1204S, 12.5x12.5x5.0mm, https://www.sunlordinc.com/Download.aspx?file=L1VwbG9hZEZpbGVzL1BERl9DYXQvMjAyMTA2MTAxMTMyMzc4MTEucGRm&lan=en Inductor, TDK, SLF6045.