synth_tools

Back

Strip, HLE-133-02-xxx-DV, 33 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF13-12P-1.25DSA, 12 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105310-xx06, 3 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator connector JST VH series connector, S16B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 6 Pin (https://www.onsemi.com/pdf/datasheet/ncp349-d.pdf#page=12), generated with kicad-footprint-generator ipc_noLead_generator.py Micro Leadframe Package, 16 pin with exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF DFN, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, B6B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOJ, 36 Pin (www.st.com/resource/en/datasheet/stm32f101t6.pdf#page=72), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-169 , 9 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, B15B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex Pico-Lock series connector, SM15B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-123-02-xx-DV-TE, 23 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_dfn_qfn_generator.py LFCSP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF (T2044-5C)), generated with kicad-footprint-generator ipc_noLead_generator.py WSON6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat Pack, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline Package (MS) [MSOP] (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20 Pin (http://www.ti.com/lit/ml/mpqf239/mpqf239.pdf), generated with kicad-footprint-generator JST XA series connector, B2B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.1 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py LGA, 14.

New Pull Request

Labels Milestones