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Male connector for 1.6mm PCB's with 30 contacts (polarized Highspeed card edge connector for IQRF TR-x2D(C)(T) modules, http://iqrf.org/weben/downloads.php?id=104 Bluetooth v4.2 + NFC module Modtronix Wireless SX1276 LoRa Module (http://modtronix.com/img/prod/imod/inair9/inair_dimensions.gif Modtronix LoRa inAir inAir9 SX1276 RF 915MHz 868MHz Wireless RAK811 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK811/Hardware_Specification/RAK811_LoRa_Module_Datasheet_V1.4.pdf RAK4200 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK811/Hardware_Specification/RAK811_LoRa_Module_Datasheet_V1.4.pdf RAK4200 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK4200/Hardware-Specification/RAK4200_Module_Specifications_V1.4.pdf Class 2 Bluetooth Module without antenna Low-Power Long Range Transceiver Module LoRa Radio, RF, Module, http://www.hoperf.com/upload/rf/RFM69HW-V1.3.pdf 8 pin package (http://datasheet.octopart.com/ZDT6758TA-Zetex-datasheet-68057.pdf Diodes Incorporated PowerDI3333-8, Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL ZIF 10.16mm 400mil Socket 3M 28-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), Socket 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 7x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils SMD DIP DIL PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST , Piano, row spacing.

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