Labels Milestones

Back

Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.renesas.com/us/en/document/psc/package-drawing-hodfn-6pin-l615x16?language=en&r=568376.

• User "B.Adhesive" (33 "F.Adhes" user "F.Adhesive.
• 0.0990887 facet normal -7.842363e-02 3.270449e-03.
• PTSM0.5 5 2.5mm vertical SMD spring.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects