Labels Milestones
Back(https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD, YZP0005 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted socket strip SMD 1x26 2.54mm single row Through hole angled pin header, 2x04, 2.00mm pitch, single row style2 pin1 right Through hole angled pin header SMD 2x13 1.27mm double row Through hole straight socket strip, 1x20, 2.54mm pitch, 6mm pin length, single row Through hole pin header THT 2x32 2.00mm double row Through hole socket strip SMD 1x09 2.00mm single row Through hole straight socket strip, 2x16, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header 2x20 2.54mm double row surface-mounted straight socket strip, 2x23, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x07, 2.00mm pitch, 4.2mm pin length, double rows Surface mounted socket strip THT 1x33 2.00mm single row Through hole angled socket strip SMD 2x31 2.54mm double row Through hole straight pin header, 2x39, 1.00mm pitch, double rows Through hole angled socket strip THT 2x20 2.54mm double row surface-mounted straight socket strip, 2x45, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 1 copper strip SMD 1x32 1.27mm single row Surface mounted pin header SMD 1x35 1.00mm.
New Pull Request