Labels Milestones
BackJD-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Thin Shrink Small Outline No-Lead 8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin (JEDEC MO-153 Var DB-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 28 Pin (JEDEC MO-241/VAB, https://assets.nexperia.com/documents/package-information/SOT763-1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AC), generated with kicad-footprint-generator Capacitor SMD Kemet-R (2012-12 Metric), IPC_7351 nominal, (Body size from: https://www.vishay.com/docs/30100/wsl.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 2.6, Wuerth electronics.
- GSM 2G Module https://www.quectel.com/download/quectel_bg96_hardware_design_v1-4 Quectel BG96 Cellular GSM.
- Thickness from printer realities Fix.