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6x8x2mm (http://www.ti.com/lit/ml/mpsi063a/mpsi063a.pdf QFN, 41 Pin (http://www.ti.com/lit/ml/mpqf506/mpqf506.pdf QFN, 28 Pin (JEDEC MO-153 Var FA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP18: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 56 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology DFN_10_05-08-1722.pdf DFN, 10 Pin (https://www.johansontechnology.com/datasheets/0900PC15J0013/0900PC15J0013.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5160, 16 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-4DP-2DSA, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST GH series connector, B07B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST XH series connector, 502585-1370 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator JST.

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