Labels Milestones
BackFit solder Pin_ diameter 1.0mm, hole diameter 1.0mm wire loop as test point, loop diameter2.6mm, hole diameter 1.2mm, length 11.3mm, width 3.0mm solder Pin_ with flat fork solder Pin_ with flat fork, hole diameter 1.0mm test point THT pad as test point, pitch 3.81mm, size 18.9x7.3mm^2, drill diamater 1.15mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/2138224.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix PT-1,5-2-3.5-H pitch 3.5mm size 7.7x7mm^2 drill 1.2mm pad 3mm Terminal Block WAGO 236-407 45Degree pitch 10mm size 62.3x14mm^2 drill 1.15mm pad 3mm Terminal Block WAGO 236-503 45Degree pitch 5mm size 30x7.6mm^2 drill 1.3mm pad 2.6mm terminal block RND 205-00023 pitch 10mm size 85x8.1mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00053, 10 pins, pitch 2.5mm, size 7.2x10mm^2, drill diamater 1.15mm, pad diameter 2.6mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310671_RT019xxHDWC_OFF-023605N.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MPT-0,5-9-2.54 pitch 2.54mm size 8.08x6.5mm^2 drill 1.1mm pad 2.1mm terminal block Metz Connect Type171_RT13705HBWC, 5 pins, single row Surface mounted pin header SMD 1x37 2.54mm single row Through hole pin header THT 2x02 1.27mm double row surface-mounted straight pin header, 2x37.
- Flange, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10118193.pdf Dustproof Micro USB.
- Pattern PL-236, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf.
- 236-424, 45Degree (cable under 45degree), 48 pins, pitch.
- Codec ESP8266 development board.