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LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET SC MOSFET Infineon PLCC, 20 pins, dual row male, vertical entry, strain relief clip Harwin LTek Connector, 44 pins, surface mount SMD Kemet EC2 signal relay DPDT double dual coil latching surface mount SMD Kemet EC2 signal relay DPDT double dual coil latching surface mount PLCC, 20 pins, dual row female, vertical entry, PN:G125-FVX1605L0X Harwin Gecko Connector, 34 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flatpack (PT) - 7x7x1.0 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL ZIF 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x9.18mm 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 6.73 mm.

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