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X 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P; No exposed pad 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package (MR) - 9x9x0.9 mm Body [TQFP] With Exposed Pad Variation; (see NXP sot054_po.pdf TO-92 2-pin variant by Heraeus, drill 0.75mm TO-92Flat package, often used for hall sensors, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf.

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