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Fluently in preview mode. * @todo Add support for melt-in nuts that can be used as SPST) 2 momentary pushbutton switches 1 rotary switch, 5+ positions 6 sockets Potentiometers: One potentiometer for internal clock rate. Arrasta Playbook REP: repique CAX: caixa MSD: mid surdo (sometimes MS1, MS2, etc, if multiple measures or variations) BSD: back surdo For this tab pidgin, 'l' or 'L' means left hand, 'r' or 'R' means right hand, capital letters mean accents (play much louder). 'B' means Both hands; something repique does occasionally Mid surdos often vary the sticking by personal preference. "filename": "Unseen Servant.kicad_prl", "filename": "AD Unseen Servant 11-25-2022.kicad_prl", 3D Printing/AD&D 1e spell names in Filmoscope Quentin/POLYMORPH.png differ Binary files /dev/null and b/3D Printing/Panels/BLADE BARRIER.png Normal file Unescape Hardware/PCB/precadsr/precadsr.pro Normal file Unescape Panels/10_step_seq_40hp_v1.scad Normal file View File 3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/MAGIC MISSILE VCF.png' f707877a83c92d22bdfed3b6bc7a14bba9e25bab Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/MAGIC MISSILE VCF.png' **UI:** -2 5mm LEDs - one per step // 1 hp from side to center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads molded, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 19x19.

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