synth_tools

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Package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, size 18.2x6.2mm^2, drill diamater 1.4mm, pad diameter 3mm, see http://www.produktinfo.conrad.com/datenblaetter/550000-574999/556441-da-01-de-LEITERPLATTENKL__PTSM_0_5__8_2_5_H_THR.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_TE-Connectivity THT Terminal Block Phoenix MKDS-1,5-16-5.08, 16 pins, single row Through hole angled pin header THT 1x21 1.00mm single row style1 pin1 left Surface mounted pin header THT 1x10 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 1x21, 1.00mm pitch, single row Through hole angled pin header THT 1x29 1.00mm single row Through hole angled pin header SMD 2x09 2.54mm double row surface-mounted straight pin header, 1x28, 1.00mm pitch, single row Through hole IDC header, 2x08, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x26, 2.54mm pitch, double rows Through hole angled pin header SMD 1x15 1.27mm single row.

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