3
1
Back

VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST CTS_Series194-4MSTN, Piano, row spacing 8.89 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 7x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils THT DIP DIL ZIF 10.16mm 400mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), Socket THT DIP DIL ZIF 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET M4 MOSFET Infineon.

New Pull Request