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Outline (ST)-4.4 mm Body with Exposed Pad Variation BB; (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator JST EH series connector, S14B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TQFP, 48 Pin (https://www.lumissil.com/assets/pdf/core/IS31FL3236_DS.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B3PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0102, With thermal vias in.

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