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15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style1 pin1 left Surface mounted socket strip SMD 1x12 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x05 2.54mm double row Through hole IDC header, 2x17, 2.54mm pitch, 8.51mm socket length, single row Through hole angled pin header, 2x25, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated.

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