Labels Milestones
BackCP236 CPG236 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 5, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf.
- Main (cylindrical or conical) shape. [mm.
- MWSA1206S-151, 13.45x12.6x5.8mm, https://sunlordinc.com/Download.aspx?file=L1VwbG9hZEZpbGVzL1BERl9DYXQvMjAyMjExMTUxNDQ4MDU0NTQucGRm&lan=en Inductor, Sunlord, MWSA22xxS, 22.0mmx23.5mm.
- Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm.