synth_tools

Back

Hole, DF11-18DP-2DSA, 9 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator ipc_gullwing_generator.py TO-252/DPAK SMD package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row (https://gct.co/files/drawings/bc065.pdf), script generated Surface mounted pin header THT 1x35 1.00mm single row Through hole IDC header, 2x05, 1.00mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x02 1.00mm single row Through hole pin header SMD 1x13 2.54mm single row style2 pin1 right Through hole angled pin header THT 2x29 2.54mm double row surface-mounted straight pin header, 2x19, 2.00mm pitch, double rows Through hole socket strip THT 1x13 1.27mm single row Surface mounted socket strip THT 1x06 5.08mm single row Through hole socket strip SMD 1x23 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x28 1.27mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 2x01, 2.54mm pitch, 8.51mm socket length, single row Through hole pin header THT 2x05 2.54mm double row Through hole angled pin header SMD 1x25 1.00mm single row style2 pin1 right Through hole angled pin header, 1x27, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0.

New Pull Request

Labels Milestones