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Vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (http://www.ti.com/lit/ds/symlink/lm26480.pdf#page=39), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 42820-22XX, 2.

• Cable Male, https://www.tme.eu/en/Document/3cbfa5cfa544d79584972dd5234a409e/XT30U%20SPEC.pdf Connector XT30.
• 4.83683 4.97711 6.93683 vertex 4.90011.
• 3.5mm solder Pin_ press fit solder Pin.
• 107x8.3mm^2 drill 1.3mm pad 2.6mm Terminal Block 4Ucon.
• 0.101047 0.992162 0.0735128 facet normal 4.851191e-001.

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