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PowerDI3333-8, Plastic Dual Flat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 18 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and.

• Vertex -9.051197e+01 1.010241e+02 1.050056e+01 facet.
• 5569-14A1, example for new part.

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