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Spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 14-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 5-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350.

• 10mm size 22.3x14mm^2 drill 1.15mm pad 3mm Terminal.
• Toggle_switch_6_8mm() { // only keep.
• CASE 100CY, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF PhotoDiode.

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