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Coupler/interrupter Vishay CNY70 refective photo coupler/interrupter Vishay CNY70 refective photo coupler IR Receiver Vishay TSOP-xxxx, MINIMOLD package, see https://www.vishay.com/docs/82493/tsop311.pdf package for Everlight ITR8307/F43, see https://everlighteurope.com/index.php?controller=attachment&id_attachment=5385 package for Everlight ITR1201SR10AR, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF PhotoDiode, plastic SMD SmatDIL PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for Everlight ITR8307 with PCB locator, 2 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator ipc_noLead_generator.py LGA, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15), generated with kicad-footprint-generator connector Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xxx-DV-BE-A, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-Y (7343-40 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Tactile Switch SPST Slide 8.61mm 338mil SMD LowProfile SMD 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 15.24 mm (600 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 7x-dip-switch SPST KingTek_DSHP07TJ, Slide, row spacing 7.62 mm (300 mils), body size 10.8x14.26mm 5x-dip-switch SPST KingTek_DSHP05TS, Slide, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 7x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 20-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4.

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