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236-301, 45Degree (cable under 45degree), 16 pins, pitch 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Vertical RM 5.45mm TO-3P-3, Vertical, RM 1.27mm, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 5.45mm TO-264-3, Vertical, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Vertical RM 2.54mm TO-251-2, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220-15, Horizontal, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 1.27mm staggered type-2 TO-220-5, Vertical, RM 0.9mm, staggered type-1 TO-247-2, Horizontal, RM 1.27mm, staggered type-2 TO-220-9, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package for diode bridges, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 9x-dip-switch SPST CTS_Series194-9MSTN, Piano, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 9x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), Socket 28-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf.

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