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Kemet-B (3528-21 Metric), IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 4.5, Wuerth electronics 9775046360 (https://katalog.we-online.com/em/datasheet/9775046360.pdf), generated with kicad-footprint-generator JST VH series connector, 502585-0470 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M1.6, height 4.5, Wuerth electronics 9775076960 (https://katalog.we-online.com/em/datasheet/9775076960.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-08P-1.25DS, 8 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-02P-1.25DSA, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DHVQFN, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/48L_VQFN_6x6mm_6LX_C04-00494a.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://www.ti.com/lit/ds/symlink/tlv9064.pdf#page=44), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3591, 35 Circuits (http://www.molex.com/pdm_docs/sd/5022503591_sd.pdf), generated with kicad-footprint-generator JST PH series connector, S2B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.15 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PHD series connector, B04P-NV (http://www.jst-mfg.com/product/pdf/eng/eNV.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-137-02-xxx-DV-BE, 37 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FH12-10S-0.5SH, 10 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 54-lead TSOP typ II package TSSOP, 4 Pin (https://www.onsemi.com/pub/Collateral/MDB8S-D.PDF#page=4), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 2.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.5mm, size 46.2x7mm^2, drill diamater 1.2mm, pad diameter 2.4mm, see http://www.4uconnector.com/online/object/4udrawing/10684.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00014 pitch 5mm size 55x9mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type175_RT02706HBLC, 6 pins, pitch 7.5mm, size 15x10.3mm^2, drill diamater 1.15mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type171_RT13706HBWC pitch 7.5mm Varistor, diameter 21.5mm, width 5.3mm, pitch 10mm size 55x8.1mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00087 vertical pitch 2.5mm size 17.2x10mm^2 drill 1.2mm.

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