Labels Milestones
Back0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 400 0.8.
- Vertical 1-215079-6 8-215079-16 TE-Connectivity Micro-MaTch.
- 7.5mm/10mm pitch, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/b40c3700.pdf Diotec.
- -9.389922e-002 9.940739e-001 vertex -1.402180e+000.