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BackAug 7 13:39:59 2021 ; FORMAT={-:-/ absolute / inch / decimal} Schematics/schematic_bugs_v1.txt Normal file View File 3D Printing/Pot_Knobs/CustomizableKnob.scad Executable file View File Hardware/PCB/precadsr_Gerbers/precadsr-Edge_Cuts.gbr Normal file Unescape HP = 5.075; // 5.07 for a single 2 mm² wires, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA.