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Width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (http://www.ti.com/lit/ds/symlink/tlc5951.pdf#page=47&zoom=140,-67,15), generated with kicad-footprint-generator ipc_noLead_generator.py Texas QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf TQFP, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347), generated with kicad-footprint-generator Soldered wire connection with double feed.

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