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Of merchantability and fitness for a single 2 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 2mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SPOX Connector System, 43045-1400 (alternative finishes: 43045-182x), 9 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST ZE series connector, S05B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 32 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT4222H.pdf#page=40), generated with kicad-footprint-generator Inductor SMD 1806 (4516 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.127 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 3.5mm, hole diameter 1.4mm wire loop as test Point, square 3.0mm side length SMD rectangular pad as test point, loop diameter 3.5mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Panelmate series connector, BM02B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CM (see ON Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [QFN] with corner pads and thermal vias; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213.

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